Siêu Thị Máy Chủ » Bộ Vi Xử Lý » Socket 1156 Intel® Xeon® Quad-Core X3450, 2.66 GHz, 8M Cache, Turbo, HT (Code Name: BX80605X3450 ; BV80605001911AQ)

Intel® Xeon® Lynnfield Quad Core X3450 2.66GHz 8MB cache, 2.5GT/s Intel QPI, Turbo Boost, Hyper-Threading.

chỉ còn 6,820,000 VNĐ

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General information Model number X3450 Frequency (MHz) 2667 Clock multiplier 20 Package 1156-land Flip-Chip Land Grid Array (FC-LGA8) 1.48" x 1.48" (3.75 cm x 3.75 cm) Socket Socket 1156 (LGA1156) Architecture / Microarchitecture Core stepping B1 (SLBLD) Manufacturing process 0.045 micron Data width 64 bit Number of cores 4 Floating Point Unit Integrated Level 1 cache size 4 x 32 KB instruction caches 4 x 32 KB data caches Level 2 cache size 4 x 256 KB Level 3 cache size 8 MB Multiprocessing Uniprocessor Features MMX instruction set SSE SSE2 SSE3 Supplemental SSE3 SSE4.1 SSE4.2 EM64T technology Virtualization technology (VT-x and VT-d) Execute Disable bit Turbo Boost Technology Trusted Execution Technology Hyper-Threading technology Low power features Thread C1/C1E, C3 and C6 states Core C1/C1E, C3 and C6 states Package C1/C1E, C3 and C6 states Enhanced SpeedStep technology  ?  On-chip peripherals Integrated 2-channel DDR3 SDRAM Memory controller Direct Media Interface PCI Express interface Electrical/Thermal parameters V core (V) 0.65 - 1.4 Minimum operating temperature (°C) 5 Maximum power dissipation (W) 189.78 (peak) 160.08 (sustained) Thermal Design Power (W) 95 STT Nhà cung cấp Liên hệ Tiền/Mua 1 Công Ty TNHH Siêu Siêu Nhỏ Địa chỉ chính: 254A Nguyễn Đình Chiểu - phường 6 - Quận 3 - Tp.Hồ Chí Minh Địa chỉ 1: 57 Láng Hạ - Thành Công Tower P. 1002, Ba Đình, HN   6,495,000 VNĐ General information Model number X3450 Frequency (MHz) 2667 Clock multiplier 20 Package 1156-land Flip-Chip Land Grid Array (FC-LGA8) 1.48" x 1.48" (3.75 cm x 3.75 cm) Socket Socket 1156 (LGA1156) Architecture / Microarchitecture Core stepping B1 (SLBLD) Manufacturing process 0.045 micron Data width 64 bit Number of cores 4 Floating Point Unit Integrated Level 1 cache size 4 x 32 KB instruction caches 4 x 32 KB data caches Level 2 cache size 4 x 256 KB Level 3 cache size 8 MB Multiprocessing Uniprocessor Features MMX instruction set SSE SSE2 SSE3 Supplemental SSE3 SSE4.1 SSE4.2 EM64T technology Virtualization technology (VT-x and VT-d) Execute Disable bit Turbo Boost Technology Trusted Execution Technology Hyper-Threading technology Low power features Thread C1/C1E, C3 and C6 states Core C1/C1E, C3 and C6 states Package C1/C1E, C3 and C6 states Enhanced SpeedStep technology  ?  On-chip peripherals Integrated 2-channel DDR3 SDRAM Memory controller Direct Media Interface PCI Express interface Electrical/Thermal parameters V core (V) 0.65 - 1.4 Minimum operating temperature (°C) 5 Maximum power dissipation (W) 189.78 (peak) 160.08 (sustained) Thermal Design Power (W) 95